wafer film thickness tester

1) Manually placing the Cassette in the Port port.
2) Mapping and picking up the Cassette by the wafer manipulator and placing it on the
PA suction cup.
3) PA calibrates the circle center and Flat position.
4) The robot picks up the calibrated wafer onto the XY stage of the OPTM measurement head.
5) The XY stage moves to measure each point of the wafer and feeds back the inspection results.
6) Based on the inspection judgment result, the wafer under test is sorted and placed on the
OK/NG station Cassette.
(7) When Cassette is full or short, the system prompts manual replacement and takes away Cassette

Product Details

1.Equipment function.
- Automatic film thickness tester EFEM, with customer OPTM measuring head, to complete automatic wafer loading, film thickness detection, sorting off.
2.Working state.
- Wafer size 8/12 inch.
- Wafer material: Sapphire, LT/LN (with transparent and non-blackened substrate), Si, SiC.
- Client-side OPTM measurement head, device size 556(W) × 566(D) × 618(H)mm, single inspection C/T about 20s.
- The need for OK/NG sorting of test wafers based on OPTM feedback measurement results.
3. Meeting the demand.
- Equipment can meet the automatic loading and sorting of 8/12 inch wafer film thickness inspection.
- Equipment PA and Mapping Sensor requirements compatible with transparent and translucent material Wafer.
- Equipment Port 4, Port form OC, each Port can be compatible with 8/12inch Cassette, one of the Port as NG under the use of material, the position can be set freely according to the need;.
The position can be freely set as needed.
- The overall cleanliness of the equipment is 1000 class.

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