● Equipment introduction
The unique optical system and software algorithm are used to measure the shape and size of edge and notch after chamfering of semiconductor substrate wafer in a non-contact manner.
● Equipment advantages
·The device can automatically measure 2-inch wafers to 12 inch wafers.
·The measurement is carried out in a non-contact manner on the wafer operating platform.
·Measurable part: length of edge, notch and OF edge (OPTION)
·Equipped with a computer control system, the measurement results can be saved in various external memory media.
·With LAN connection function, the measured data can be viewed at any time within the network range
● Equipment data and specifications
