●It can process various wafer materials such as SiC, GaN, and sintered materials by cutting by diamond fixed abrasive processing method.
●High-precision and high-speed machining of ultra-high line speed ~8 inches of high-hardness materials. Unique shaking mechanism, control mechanism to avoid disconnection.
●The industry-leading maximum line speed of 3,000m/min can greatly shorten the processing time, reduce warpage, and reduce the amount of wire used.
