Edge grinder

● Adopt high-speed rotating diamond grinding wheel to carry out high-precision grinding on the wafer edge.
● It can process a variety of wafer materials such as Si, GaAs, InP, SiC, LT/LN, sapphire, etc.
● Compatible with 4-8in and 12in special wafer processing, mass production type.


3 Features
a. Chamfer accuracy
--Angle: 11 º (H type), 22 º (G type)
--Width and roughness: diamond grinding wheel
b. Centering
c. Precise control of distance between grinding wheel and rotary table